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characteristic:-Applied in full kinds of chip package type-support high&low temp testing(-50~150°C)-simply structure, excellent stability-Applied in FT, SLT, Burn-in testing etc

characteristic:-support 4000pcs pin count chip testing-support 200W above power testing-use the heat pipe technology, stability and high efficiency-optimizing the mechanical stress design

characteristic:-Applied in 0 35 pitch above package-support high current testing(3A above)-(both support pogo pin and union connector solution )-low contact resistance and excellent stability

characteristic:-Applied in WLCSP package with 0 35 above-support RF performance testing-support high&low temp(-40~125°